200 mm Wafer Prober incl. Temperature Testing (IIS-05.1) - PR1227015-2440-P

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1 piece 200 mm Wafer Prober incl. Temperature Testing (IIS-05.1) This specification describes the requirements for one wafer probing system to be used for characterization and test engineering for sensor ICs and chiplets at the Fraunhofer IIS. The system must allow handling of 200 mm and 300 mm wafers and 300 mm dicing frames. The focus in the usage of the machine does not depend on short handling time and high throughput, but on accuracy in probing and possibility for stimulation of optical and magnetic sensors. For stimulation of optical sensors a darkened DuT chamber is mandatory. The Wafer Chuck has to be made of non-magnetic materials to prevent distortion while characterizing magnetic field sensors. Option: 4.2 Wafer Chuck ATT dry air control 4.9 Wafer Chuck high voltage preparation 5.5 Loading OCR reader (top side) 5.6 Loading Wafer ID capture for text with standard and non-standard fonts, barcode and QR code 9.1 Electrical interface and remote control Possibility for remote control of the prober system 9.2 Electrical interface and remote control GPIB interface (IEEE-488)

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