Ätzanlage zum tiefen Silicium-Ätzen für MEMS

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Ruhr University Bochum intends to procure a DRIE etching system to be used in the Microelectronics Research Laboratory Bochum for wafer substrates up to 200 mm diameter. It shall be used in the field of silicon-based micro-electro-mechanical systems (MEMS) for deep anisotropic silicon etching based on a cyclic etching process (DRIE, "BOSCH process") and furthermore serve the research of new etching concepts that use less climate-damaging etching gases. Ruhr University Bochum intends to procure a DRIE etching system to be used in the Microelectronics Research Laboratory Bochum for wafer substrates up to 200 mm diameter. It shall be used in the field of silicon-based micro-electro-mechanical systems (MEMS) for deep anisotropic silicon etching based on a cyclic etching process (DRIE, "BOSCH process") and furthermore serve the research of new etching concepts that use less climate-damaging etching gases.

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