Published
Ätzanlage zum tiefen Silicium-Ätzen für MEMS
Notice number: ocds-mnwr74-c859db0a-fabf-43ac-b7eb-a242bcd86fbf
KEY INFORMATION
- Submission deadline
- • Sep 14, 2026
- Location
- 🇩🇪 Germany
- Contracting authority
- Ruhr-Universität Bochum
- Accepted Languages
- DEU
- Tender type
- Goods
- Contract Value
- Published date
- Aug 13, 2026
TENDER DESCRIPTION
Ruhr-University Bochum intends to procure a DRIE etching system to be used in the Microelectronics Research Laboratory Bochum for wafer substrates up to 200 mm in diameter. It is intended to be used in the field of silicon-based micro-electro-mechanical systems (MEMS) for deep anisotropic silicon etching based on a cyclic etching process (DRIE, "BOSCH process") and furthermore to serve the research of new etching concepts that use less climate-damaging etching gases.
TENDER BRIEF
Login to view all answers and insights
Unlock tender brief for freeTENDER DOCUMENTS
DIRECTORY • 1 FILE
- n/aLINK
Login to view and download all tender documents
Unlock documents for freeASK AI ABOUT THIS TENDER
Can a foreign company apply?
Yes, foreign companies can apply as long as they meet all the requirements set out in the procurement documents.
Login to ask more questions.
Unlock AI tender chat for freeUnlock your tender workflow
Run your first search, evaluate the results, save a daily monitor and start building a pipeline of tenders worth pursuing.