Drahtbondautomat bzw. Drahtbondhalbautomat, - Ausführung als ein Tischgerät -

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Delivery and commissioning of a flexibly usable wire bonder or wire half-automaton configured as a bench-top unit, which ensures precise, modern and long-term future-proof electronics production and thereby sustainably supports research, teaching and student projects. The acquisition of a new wire bonder or wire half-automaton serves to sustainably strengthen research, teaching and student development projects in the field of electronics and microsystem manufacturing. The system should enable precise and efficient manufacturing of wire-based connections in accordance with the state of the art, thereby significantly supporting both academic work and practice-oriented training content. Particular value is placed on high flexibility in order to cover a broad range of current and future requirements – from prototype production through small series to experimental research setups. The machine should be extendable in a modular manner and compatible with different bonding processes, wire and semiconductor materials, housing and substrate types as well as different substrate geometries. By integrating the system into teaching and research operations, students gain practical access to…

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