Published
Flip Chip Die Bonder
Notice number: ocds-mnwr74-729d2423-22eb-4079-84c6-70478cfbd2f8
KEY INFORMATION
- Submission deadline
- • Sep 22, 2026
- Location
- 🇩🇪 Germany
- Contracting authority
- FAIR - Facility for Antiproton and Ion Research in Europe GmbH
- Accepted Languages
- ENG
- Tender type
- Goods
- Contract Value
- Published date
- Aug 23, 2026
TENDER DESCRIPTION
The Flip-chip Die bonder should include the following process modules: - Precision die bonding (face up) - Flip chip bonding (face down) - adapted system work table - chip and substrate heating with process gas enclosure - software-controlled bonding force module - ultrasonic bonding module - in-situ monitoring with video camera - form generator for creating reference elements for face up alignment - tool tip changing module - three different tool tips - tool tip support including heater - dispenser module for paste and liquids - UV-curing module - die-eject module
TENDER BRIEF
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Yes, foreign companies can apply as long as they meet all the requirements set out in the procurement documents.
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