Published
Fourniture d’une machine de câblage filaire ultrasonique 12μm.
Notice number: 00535769-2026
KEY INFORMATION
- Submission deadline
- • Sep 14, 2026
- Location
- 🇫🇷 France
- Contracting authority
- CEA Grenoble
- Accepted Languages
- French, English
- Tender type
- Goods
- Contract Value
- Published date
- Aug 3, 2026
TENDER DESCRIPTION
The LAIP, Laboratory of Assembly and Integration of Components for Photonics, carries out wire bonding steps for its functional device packaging activities. The current evolution of performance and the miniaturization of pad sizes on the chips leads us to procure a new wire bonding machine capable of performing ultrasonic welding with 12μm wires versus the 25μm standard on the current market. This document defines our requirements for the acquisition of a new machine. Overall, it should allow bonding at a minimum of 12μm but also at 25 and 75μm, from chips to packages or the interconnection of chips directly on 200mm wafers. The equipment must also allow semi-automatic wiring of wires of dimensions. The LAIP, Laboratory of Assembly and Integration of Components for Photonics, carries out wire bonding steps for its functional device packaging activities. The current evolution of performance and the miniaturization of pad sizes on the chips leads us to procure a new wire bonding machine capable of performing ultrasonic welding with 12μm wires versus the 25μm standard on the current market. This document defines our requirements for the acquisition of a new machine. Overall, it…
TENDER BRIEF
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DIRECTORY • 3 FILES
- Submission PortalLINK
- non-restricted-documentLINK
- TED PortalLINK
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