Published
Lieferung eines vollautomatischen Drahtbonders
Notice number: ocds-mnwr74-020c12eb-3009-4e65-aadd-3b6a432dbc4b
KEY INFORMATION
- Submission deadline
- • Sep 28, 2026
- Location
- 🇩🇪 Germany
- Contracting authority
- IHP GmbH - Leibniz-Institut für innovative Mikroelektronik
- Accepted Languages
- DEU
- Tender type
- Goods
- Contract Value
- Published date
- Aug 27, 2026
TENDER DESCRIPTION
The subject of the tender is the delivery, installation, commissioning and instruction in the operation of a brand-new, fully automatic wire bonder for use in research and development. The system to be offered must be designed to carry out Wedge-Wedge and Ball-Wedge bonding processes and enable highly precise and reproducible processing of aluminium and gold wires with wire diameters of 12.5 to 32 µm as well as of gold ribbons with widths of 35 to 50 µm. The system must have fully automatic image recognition, real-time process monitoring and a programmable loop geometry. It must be suitable for continuous operation in a research environment with high requirements for precision, process stability, documentation and reproducibility. The system to be offered must be designed for safe operation in laboratory and development environments.
TENDER BRIEF
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