Published
Die-Bonder
Notice number: ocds-mnwr74-01a11a53-d86c-44e3-a264-a764fb3ca60d
KEY INFORMATION
- Submission deadline
- • Nov 16, 2026
- Location
- 🇩🇪 Germany
- Contracting authority
- Hahn-Schickard gGmbH
- Accepted Languages
- DEU
- Tender type
- Goods
- Contract Value
- Published date
- Oct 9, 2026
TENDER DESCRIPTION
Implementation, delivery, installation, commissioning, acceptance, documentation of a Die-Bonder for highly precise assembly of chips and modules with placement accuracy in the sub-micrometer range. A complete system enclosure enables a controlled process environment with cleanroom quality for highly stable assembly processes with the focus on maximum yield. The operating spectrum ranges from very flexible R&D processes to 24/7 production. The specification is decisive.
TENDER BRIEF
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