Published
Waferprober / Frameprober - PR1252431-2270-W
Notice number: ocds-mnwr74-125c09ce-0462-4606-aea8-fa1226cb5c4b
KEY INFORMATION
- Submission deadline
- • Sep 7, 2026
- Location
- 🇩🇪 Germany
- Contracting authority
- Fraunhofer-Gesellschaft, Einkauf B12
- Accepted Languages
- DEU
- Tender type
- Goods
- Contract Value
- Published date
- Aug 6, 2026
TENDER DESCRIPTION
This specification describes the requirements for a wafer prober system to be used for post-silicon verification, characterization and functional test of integrated circuits and chiplets at Fraunhofer EMFT. The wafer prober system must be able to handle 200mm and 300mm wafers and in addition wafers mounted on a dicing frame (frame prober function). This allows a very flexible usage for different analysis and test situations. The wafer prober will be coupled with an automated test system (ATE).
TENDER BRIEF
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Yes, foreign companies can apply as long as they meet all the requirements set out in the procurement documents.
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